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Pulling solder balls from substrates to measure adhesion between die solder balls and substrate, to assess the ability of solder balls to withstand...

The principle of conventional wire bond testing is to move the test hook under the bonding wire and remove the Pull up in the Z-axis direction unti...

The test of rubber tear strength is carried out by tear test, and the test specimens of tear test are trouser, Delft, crescent and right angle. The...