The Principle Of Tension Function Of Welding Wire

The principle of conventional wire bond testing is to move the test hook under the bonding wire and remove the Pull up in the Z-axis direction until the weld is broken (destructive testing) or to a predefined force (non-destructive testing). Also refer to: Cold/Hot Solder Bump Pull-JEITA EIAJ ET-7407, Flip Chip Pull-JEDEC JESD22-B109, Cold Solder Bump Pull-JEDEC JESD22-B115, Lead Pull-DT/NDT MIL STD 883 and other related standards . The test range of tensile test can be 0-100G; 0-1KG; 0-10KG is more common. The working principle is also applicable to the tensile test weld strength tester for gold wire/gold wire bonding, aluminum wire, copper wire, alloy wire, aluminum strip, etc.